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Chip on board (COB) Encapsulants

15.03.2023

Encapsulants provide unmatched performance for a wide range of products, including transistors, system-in-package (SIP) devices, ASICs and chip-on-board applications. Henkel’s LOCTITE® and LOCTITE ECCOBOND-COB encapsulation compounds are primarily used to provide protection from external influences and to increase the mechanical strength of wired components.

For more information, follow the link to our electronic adhesives page.

Corporate Marketing

Senefeldertraße 176
63069 Offenbach am Main
Germany

+49 69 838326-137
+49 69 838326-166
marketing@bm-chemie.de

Events

European Coatings Show 2023

28.03.2023 - 30.03.2023, 90471 Nürnberg

JEC World 2023

25.04.2023 - 27.04.2023, Paris

Car Symposium 2023

03.05.2023 - 04.05.2023, Bochum
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News

Bonding technologies in industrial production: Technical seminar in Heidelberg Bodo Möller Chemie presents modern bonding solutions in the May 11, 2023 TechDialog

14.03.2023

Bodo Möller Chemie presents modern bonding solutions in the May 11, 2023 TechDialog
Specific challenges are discussed in small-group workshops

Bodo Möller Chemie and Von Roll cooperate in the area of electronics resin systems Portfolio expansion in the area of casting resins for the electrical and electronics industry

13.03.2023

Portfolio expansion in the area of casting resins for the electrical and electronics industry

Bodo Möller Chemie Group expands business activities in West Africa New warehouse for speciality chemicals supplies Nigeria, Cameroon, Senegal, Ivory Coast and Ghana

09.02.2023

New warehouse for speciality chemicals supplies Nigeria, Cameroon, Senegal, Ivory Coast and Ghana
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