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Chip on board (COB) Encapsulants

15.03.2023

Encapsulants provide unmatched performance for a wide range of products, including transistors, system-in-package (SIP) devices, ASICs and chip-on-board applications. Henkel’s LOCTITE® and LOCTITE ECCOBOND-COB encapsulation compounds are primarily used to provide protection from external influences and to increase the mechanical strength of wired components.

For more information, follow the link to our electronic adhesives page.

Corporate Marketing

Senefeldertraße 176
63069 Offenbach am Main
Germany

+49 69 838326-137
+49 69 838326-166
marketing@bm-chemie.de

Events

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TechDialogue 2026: Solutions for demanding Electronics Manufacturing

01.12.2026, Heidelberg

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JEC World 2027

02.03.2027 - 04.03.2027, Villepinte

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European Coatings Show 2027

27.04.2027 - 29.04.2027, Nürnberg
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News

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22.09.2026

New Executive for Growing MEA Region

Bodo Möller Chemie opens new warehouse for aerospace and specialty chemicals in India AS 9120-certified: Infrastructure as per international stocking standards

07.07.2026

AS 9120-certified: Infrastructure as per international stocking standards

Bodo Möller Chemie takes part in official trade mission to China Strategic position on Asian future markets

03.06.2026

Strategic position on Asian future markets
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