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Chip on board (COB) Encapsulants


Encapsulants provide unmatched performance for a wide range of products, including transistors, system-in-package (SIP) devices, ASICs and chip-on-board applications. Henkel’s LOCTITE® and LOCTITE ECCOBOND-COB encapsulation compounds are primarily used to provide protection from external influences and to increase the mechanical strength of wired components.

For more information, follow the link to our electronic adhesives page.

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European Coatings Show 2023

28.03.2023 - 30.03.2023, 90471 Nürnberg

JEC World 2023

25.04.2023 - 27.04.2023, Paris

Car Symposium 2023

03.05.2023 - 04.05.2023, Bochum


Bodo Möller Chemie presents modern bonding solutions in the May 11, 2023 TechDialog
Specific challenges are discussed in small-group workshops