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Chip on board (COB) Encapsulants

15.03.2023

Encapsulants provide unmatched performance for a wide range of products, including transistors, system-in-package (SIP) devices, ASICs and chip-on-board applications. Henkel’s LOCTITE® and LOCTITE ECCOBOND-COB encapsulation compounds are primarily used to provide protection from external influences and to increase the mechanical strength of wired components.

For more information, follow the link to our electronic adhesives page.

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