Select Page
Generic filters
Exact matches only

Thermal management materials

To fulfill the thermal requirements of today's electronic devices, we offer a complete portfolio of high-performance and user-friendly thermal conductive materials. Effective thermal management is critical for manufacturers of modern electronics. As devices become smaller, dissipating heat becomes increasingly important to prevent potentially harmful overheating. Our thermal management materials offer all-round solutions for all your needs.

BERGQUIST® BOND-PLY Adhesives tapes

Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion. More information


GAP FILLER is supplied as a one or two-part component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling electronic components on PC boards with an adjacent metal case or heat sink. Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process. More information


GAP PADs provide an effective thermal interface between heat sinks and electronic devices to offset uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interfacial resistance. GAP PADs reduce the stress on component leads, dampen vibration and are compatible with automatic dosing systems. More information


HI-FLOW phase change materials are an optimal replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow. More information

BERGQUIST® SIL PAD® Electrically insulating thin pads

The thermally conductive insulation pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, cleaner in processing than greases and extremely cost effective. More information

BERGQUIST® SIL PAD® Non-electrically insulating thin pads

These materials are designed for those applications when maximum heat transfer is needed and electrical isolation is not required, making SIL PAD® the ideal thermal interface material to replace messy thermal-grease compounds. More information





Bodo Möller Chemie obtains majority share in distribution company Losi Group and expands into aerospace market

JEC World: Bodo Möller Chemie presents technological innovations and an expert lecture during the trade fair.

Bodo Möller Chemie expands its collaboration with SONGWON and is now exclusive distributor for coating products in Germany.