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Thermal Management Materials

To fulfill the thermal requirements of today's electronic devices, we offer a complete portfolio of high-performance and user-friendly thermal conductive materials. Effective thermal management is critical for manufacturers of modern electronics. As devices become smaller, dissipating heat becomes increasingly important to prevent potentially harmful overheating. Our thermal management materials offer all-round solutions for all your needs.

BERGQUIST® BOND-PLY Adhesives Tapes

Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion.

BERGQUIST® GAP FILLER

GAP FILLER is supplied as a one or two-part component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling electronic components on PC boards with an adjacent metal case or heat sink. Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process.

BERGQUIST® GAP PAD®s

GAP PADs provide an effective thermal interface between heat sinks and electronic devices to offset uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interfacial resistance. GAP PADs reduce the stress on component leads, dampen vibration and are compatible with automatic dosing systems.

BERGQUIST® HI-FLOW Pads

HI-FLOW phase change materials are an optimal replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow.

BERGQUIST® SIL PAD® Electrically insulating thin pads

The thermally conductive insulation pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, cleaner in processing than greases and extremely cost effective.

BERGQUIST® SIL PAD® Non-electrically insulating thin pads

These materials are designed for those applications when maximum heat transfer is needed and electrical isolation is not required, making SIL PAD® the ideal thermal interface material to replace messy thermal-grease compounds.

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