BERGQUIST® BOND-PLY Adhesives TapesAvailable in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion.
BERGQUIST® GAP FILLERGAP FILLER is supplied as a one or two-part component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling electronic components on PC boards with an adjacent metal case or heat sink. Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process.
BERGQUIST® GAP PAD®sGAP PADs provide an effective thermal interface between heat sinks and electronic devices to offset uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interfacial resistance. GAP PADs reduce the stress on component leads, dampen vibration and are compatible with automatic dosing systems.
BERGQUIST® HI-FLOW PadsHI-FLOW phase change materials are an optimal replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow.
BERGQUIST® SIL PAD® Electrically insulating thin padsThe thermally conductive insulation pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, cleaner in processing than greases and extremely cost effective.
BERGQUIST® SIL PAD® Non-electrically insulating thin padsThese materials are designed for those applications when maximum heat transfer is needed and electrical isolation is not required, making SIL PAD® the ideal thermal interface material to replace messy thermal-grease compounds.