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Electronic casting & encapsulation

In the electrical industry, the encapsulation of electrical and electronic components and assemblies is increasingly being used to improve electrical properties, thermal stability and mechanical strength as well as to protect against the effects of chemical substancesand environmental influences. Depending on the product, the production technology and the respective operating conditions, different electrical insulation materials with specificproperties are used.

Adhesives for electronic components

Adhesives are used in a wide variety of applications in the manufacture of electrical or electronic components and devices, such as the assembly or fixing of components or the bonding or sealing of housings. In addition to the actual adhesion properties, other special requirements such as flame retardancy and heat conduction often have to be taken into account.

Casting resins & encapsulants

Materials for the classical potting of components or assemblies suitable for manual or plant potting under atmospheric pressure, vacuum or pressure gelation. Depending on therequirements, potting materials with thermoset or elastomeric end properties on different chemical bases (polyurethanes, epoxy resins, silicones) and with different processing and curing properties are used.

Cleaning products for electronics

Reliable cleaning products for electronics assembly and semiconductor applications. The cleaners are designed for use in standard inline and batch flux removal systems, die and misprint cleaners and steam degreasing systems.

Hotmelt casting compounds

Thermoplastic plastics for low-pressure casting in electronic and electrical applications, e.g. casting of circuit boards and plugs, sealing of cables. Hotmelt materials are not reactive. The application takes place in solid forms, comparable to plastic injection moulding. The materials used are high-quality thermoplastic polyamide hot-melt adhesives (PA) with elastomeric properties.

Impregnating resins

Impregnating resins based on epoxy resin cure without releasing volatile substances and result in end products with excellent electrical and mechanical properties with extremely low shrinkage. They are therefore particularly suitable for impregnating high-voltage windings.

Other materials & auxiliaries for electric processing

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Silicone encapsulants

Silicones are elastomeric materials with high elasticity. They are characterized by excellent low-temperature flexibility, which makes them particularly suitable for encapsulating pressure-sensitive components. Silicone encapsulants enable high operating temperatures and exhibit very good chemical resistance. Depending on the application, electro casting predominantly uses addition-curing 2-component systems, but also air moisture-curing 1-component products.

Trickle resins

Trickle resins are mainly used in electrical engineering for impregnating the windings of motors and generators. Optimally adjusted rheological properties and the specific gelling and curing behavior of the resin systems enable impregnation using the rotary trickle process.

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Electric Seminar 2019

24.10.2019, Heidelberg

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Bodo Möller Chemie will conduct a technical seminar on 24th October 2019 in Heidelberg

Certification of Bodo Möller Chemie in Israel according to ISO 9001

Bodo Möller Chemie markets the newly introduced Araldite® 2050 and Araldite® 2051 methyl methacrylate adhesives