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Hotmelt casting compounds

Thermoplastic plastics for low-pressure casting in electronic and electrical applications, e.g. casting of circuit boards and plugs, sealing of cables. Hotmelt materials are not reactive. The application takes place in solid forms, comparable to plastic injection moulding. The materials used are high-quality thermoplastic polyamide hot-melt adhesives (PA) with elastomeric properties.

Euromelt® 2-component polyamide hotmelt casting compounds

1-component co-polyamides for a wide operating temperature range and low viscosity for very good flow behavior with only low potting pressure.

Bodo Möller Chemie





Bodo Möller Chemie intensifies its collaboration with BASF SE in the segment of Resins and Performance Additives for Paints and Coatings in Northwest Africa