Bodo Möller Chemie Insights
We distribute the two-component epoxy adhesives ARALDITE® 2012 from Huntsman, this adhesive enables complex bonding applications with short processing times.
Bodo Möller Chemie offers a wide portfolio of hotmelt adhesives, among others the Technomelt® Supra 176 from the market leader Henkel.
In the electrical industry, the encapsulation of electrical and electronic components and assemblies is increasingly being used. Bodo Möller Chemie assists you in selecting a suitable encapsulation material for your particular application.
With the new Irganox© CB product line from BASF, Bodo Möller Chemie is able to offer its customers a highly effective stabilizer package that has been specially developed for use in recycled materials.
For various additive manufacturing processes, such as Fused Filament Fabrication (FFF/FDM), Fused Granulate Fabrication, Powder Bed Fusion, Stereolithography and Digital Light Processing a wide range of consumables.