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Hotmelt casting compounds

Thermoplastic plastics for low-pressure casting in electronic and electrical applications, e.g. casting of circuit boards and plugs, sealing of cables. Hotmelt materials are not reactive. The application takes place in solid forms, comparable to plastic injection moulding. The materials used are high-quality thermoplastic polyamide hot-melt adhesives (PA) with elastomeric properties.

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Euromelt® 2-component polyamide hotmelt casting compounds

1-component co-polyamides for a wide operating temperature range and low viscosity for very good flow behavior with only low potting pressure.
Aerospace & defense | Automotive | Bus & truck | E-mobility | Electronics | Marine | Rail | Wind energy

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New shareholder structure at Bodo Möller Chemie Korinna Möller-Boxberger and Frank Haug lead cross-generational family enterprise

21.12.2023

Korinna Möller-Boxberger and Frank Haug have assumed sole ownership of Bodo Möller Chemie since Viola Möller’s departure on December 7, 2023.

Bodo Möller Chemie on course for growth in Baltics Entering the automotive sector market with Henkel

27.11.2023

Bodo Möller Chemie is expanding its partnership with Henkel with its new subsidiary Bodo Möller Chemie Baltics OÜ in Tartu, Estonia.

Bodo Möller Chemie and CABB form partnership Dianhydrides for high-performance epoxy and polyimide formulas

08.11.2023

Bodo Möller Chemie is expanding its portfolio in the CASE sector (coatings, adhesives, sealants and elastomers) through its collaboration with CABB, the dianhydride specialist.

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