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Assemblies & printed circuit boards

Electronic components, assemblies and printed circuit boards are predominantly exposed to thermal loads. The sustainable goal of encapsulated electronic components in an assembly is to secure and guarantee their electrical function over a long period of time.

Araldite® 2-component epoxy resin adhesives

Depending on the type, they can be used for structural bonding of metals, thermosets and reinforced plastics. Can have very high strength and temperature resistance (up to 210°C).

Arathane® 2-component polyurethane casting resins

Potting compounds with very good processing properties, for very flexible to hard moulding materials with good temperature stability up to thermal class F, thermally conductive, UL94.

BERGQUIST® BOND-PLY Adhesives tapes

Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion. More information


GAP FILLER is supplied as a one or two-part component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling electronic components on PC boards with an adjacent metal case or heat sink. Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process. More information


GAP PADs provide an effective thermal interface between heat sinks and electronic devices to offset uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interfacial resistance. GAP PADs reduce the stress on component leads, dampen vibration and are compatible with automatic dosing systems. More information


HI-FLOW phase change materials are an optimal replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow. More information

BERGQUIST® SIL PAD® Electrically insulating thin pads

The thermally conductive insulation pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, cleaner in processing than greases and extremely cost effective. More information

BERGQUIST® SIL PAD® Non-electrically insulating thin pads

These materials are designed for those applications when maximum heat transfer is needed and electrical isolation is not required, making SIL PAD® the ideal thermal interface material to replace messy thermal-grease compounds. More information

Bluesil™ 2-component silicones

2-component silicone casting compounds, optically clear or containing filler for higher heat dissipation.

Bluesil™ Silicone gels

2-component silicones with gel-like end properties, extremely low hardness and extremely low elasticity modulus, optically clear.

Euromelt® 2-component polyamide hotmelt casting compounds

1-component co-polyamides for a wide operating temperature range and low viscosity for very good flow behavior with only low potting pressure.

LOCTITE® ABLESTIC Electrically conductive adhesives

Electrically conductive adhesives ensure strong bonds between components and printed circuit boards – for reliable, long-term performance that meets demand. More Information

LOCTITE® Conformal Coatings

LOCTITE® Conformal coatings protect printed circuit boards and substrates from thermal shock, humidity, corrosive liquids and other adverse environmental conditions, ensuring long product life cycles for exposed applications in the marine, automotive, medical and consumer electronics markets. More information or buy online now.


Encapsulants provide unmatched performance for a wide range of products, including transistors, system-in-package (SIP) devices, ASICs and chip-on-board applications. More Information

LOCTITE® ECCOBOND Underfill materials

Underfillers are designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress in packages. Weitere Informationen.

LOCTITE® Film adhesives

Epoxy film adhesives are perfectly suited for large bonding areas that also require uniformed bondlines and custom sizes and shapes. Assembly films are proven solutions for the most demanding applications requiring the highest reliability. More Information

LOCTITE® Surface mount adhesives

SMA adhesives are based on 1K thermosetting epoxies. They are preferably used for wave soldering and also to achieve additional adhesion during reflow soldering. The material ensures sufficient adhesion even in the uncured state. We offer printable as well as dispensable products. More information or buy online now.

Thermally conductive silicones

2-component silicone casting compounds, gels and gap fillers with excellent thermal conductivity.

Bodo Möller Chemie



Bodo Möller Chemie obtains majority share in distribution company Losi Group and expands into aerospace market

JEC World: Bodo Möller Chemie presents technological innovations and an expert lecture during the trade fair.

Bodo Möller Chemie expands its collaboration with SONGWON and is now exclusive distributor for coating products in Germany.