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Assemblies & printed circuit boards

Electronic components, assemblies and printed circuit boards are predominantly exposed to thermal loads. The sustainable goal of encapsulated electronic components in an assembly is to secure and guarantee their electrical function over a long period of time.

Araldite® 2-component epoxy resin adhesives

Depending on the type, they can be used for structural bonding of metals, thermosets and reinforced plastics. Can have very high strength and temperature resistance (up to 210°C).

Arathane® 2-component polyurethane casting resins

Potting compounds with very good processing properties, for very flexible to hard moulding materials with good temperature stability up to thermal class F, thermally conductive, UL94.

Bluesil™ 2-component silicones

2-component silicone casting compounds, optically clear or containing filler for higher heat dissipation.

Bluesil™ Silicone gels

2-component silicones with gel-like end properties, extremely low hardness and extremely low elasticity modulus, optically clear.

Euromelt® 2-component polyamide hotmelt casting compounds

1-component co-polyamides for a wide operating temperature range and low viscosity for very good flow behavior with only low potting pressure.

SILCOTHERM Thermally conductive silicones

2-component silicone casting compounds, gels and gap fillers with excellent thermal conductivity.

Events

TechTage 2019

05.06.2019, Neustadt an der Donau

Electric Seminar 2019

24.10.2019, Heidelberg

News

E-mobility, lightweight construction and modern surface technologies are important themes for the future of composites

Industry summit under the banner “Composites materials are shaping our lives and our future”