LED technology
Transparent silicones are ideally suited for encapsulating special LED assemblies. These products are characterized by high elasticity and special low-temperature flexibility, which enable the encapsulation of pressure-sensitive components. Silicone potting compounds guarantee high operating temperatures and exhibit very good chemical resistance. Depending on the application, electrical encapsulation mainly uses addition-curing 2-component systems, but also air moisture-curing 1-component products.
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BERGQUIST® BOND-PLY Adhesives tapes
Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion. More informationBERGQUIST® GAP FILLER
GAP FILLER is supplied as a one or two-part component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling electronic components on PC boards with an adjacent metal case or heat sink. Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process. More informationBERGQUIST® GAP PAD®s
GAP PADs provide an effective thermal interface between heat sinks and electronic devices to offset uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interfacial resistance. GAP PADs reduce the stress on component leads, dampen vibration and are compatible with automatic dosing systems. More informationBERGQUIST® HI-FLOW Pads
HI-FLOW phase change materials are an optimal replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow. More informationBERGQUIST® SIL PAD® Electrically insulating thin pads
The thermally conductive insulation pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, cleaner in processing than greases and extremely cost effective. More informationBERGQUIST® SIL PAD® Non-electrically insulating thin pads
These materials are designed for those applications when maximum heat transfer is needed and electrical isolation is not required, making SIL PAD® the ideal thermal interface material to replace messy thermal-grease compounds. More informationBluesil™ 2-component silicones
2-component silicone casting compounds, optically clear or containing filler for higher heat dissipation.Bluesil™ Silicone gels
2-component silicones with gel-like end properties, extremely low hardness and extremely low elasticity modulus, optically clear.DOWSIL™ and SYLGARD™ Silicone encapsulants
Encapsulants offer greater design flexibility. Their softness and lower stress make them ideal for devices with sensitive components. Thermally conductive pottants protect from moisture and dust while dissipating heat and absorbing component noise.PACTAN 1-component silicones
Neutral-curing 1-component silicones with very good adhesion properties for potting and sealing electrical components.Thermally conductive silicones
2-component silicone casting compounds, gels and gap fillers with excellent thermal conductivity.
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Events
Seminar: Design and application of chemical products in electronics production
14.05.2024, Rapperswil-Jona
TechDialog: Adhesive technologies in industrial manufacturing
16.05.2024, Heidelberg
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