Bodo Möller Chemie will participate at the fair Bondexpo in 2012 in Stuttgart.
As a professional partner and supplier of a variety of adhesive systems and adhesive applications this year’s trade fair appearance of Bodo Möller Chemie goes far beyond specialized content.
The company offers an insight into the complete product portfolio. This includes high-performance adhesive systems, among others on epoxy, polyurethane and methylmethacrylate basis, and sealants, materials for pre and post treatment and additives for adhesives. With this broad range of products and comprehensive advice Bodo Möller Chemie serves various industrial sectors such as automotive and transportation construction, electrical and electronics applications, aerospace and composites, building and construction, paper and packaging.
At the starting line: Our partners Huntsman Advanced Materials, Dow Automotive Systems and Bluestar Silicones.
Together with our international partners, we would like to welcome you at our stand. Let us surprise you: You can expect interesting products and rapid highlights.
You will find us from 8th to 11th October 2012 in Hall 7, Stand 7407
More information about the exhibition can be found here
You are welcome to make an appointment, please contact us at the email address info(at)bm-chemie.de
Join us at the 6th international trade fair for industrial adhesive applications and technologies Bondexpo. We look forward to your visit!
Datum: 10/08/2012 - 10/11/2012
Ort: Gustav-Werner-Straße 6, Frickenhausen