TechDialog: Adhesive technologies in industrial manufacturing
We have now made the successful seminar even more interactive and, above all, more practical for you. Our advanced training offers you a comprehensive overview and provides a deep insight into the world of bonding.
Due to the wide range of adhesive technologies with different requirements, the seminar is suitable for beginners up to specialists.
Interactive professional seminar with practical workshops
Adhesive technologies in industrial manufacturing
15th May 2025 in Heidelberg
(registration deadline 02. May 2025)
Discover the latest developments in modern adhesive technologies and refresh your knowledge in our technical seminar for users and specialists of adhesive systems.
The new concept of our seminar – separated into lecture and small group workshops – gives you the opportunity to discuss your questions and product requirements directly with our technical experts in small groups, if required. We thus facilitate an interactive exchange and offer you concrete solutions to individual problems.
In addition to topics on adhesive selection and its application in practice, you can expect workshops on adhesive applications as well as on high-performance adhesive tapes. The basic knowledge as a foundation is perfectly complemented by an in-depth workshop on adhesive technology.
We also present you a technological innovation: Debonding on Demand
Take the chance and benefit from the expertise of our technical experts!
Register now!
The number of participants is limited.
(Early bird price valid until 04. April 2025)
Your benefits:
Comprehensive first-hand expertise and know-how
Discuss your projects with our specialists
Learn about possibilities for process optimization
Recognition of further training for (executive) bonding technology personnel possible
EAB | EAS | EAE
Qualified further training to expand your expertise
On-site exchange with our industry-experienced experts
Seminar contents
15th May 2025, 09:00 – 17:00 h
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Basics of adhesive technology
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Adhesive selection and application in practice
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High-performance adhesive tapes: Easy application, top performance
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Advanced know-how in adhesive technology
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Innovative pre-treatment and cleaning: PlasmaPlus und HydroPlasma
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Technical consulting for your individual adhesive applications
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Discussion
The seminar day will be rounded off with a joint dinner, which will give you further opportunity to exchange with our experts and the participants.
The seminar will be held in German.
Registration
Once you have registered with us, we will check and confirm your registration. The invoice will be sent accordingly. The login data to our download area will be sent a few days before the seminar.
The seminar starts in
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Costs
Early bird price 325 € / person plus VAT. (valid until 04. April 2025)
Seminar fees 375 € / person plus VAT. (registration deadline 02. May 2025)
incl. digital seminar documents, 1x lunch buffet, 3x coffee breaks, dinner and
participant certificate
Cancellation: If the registration is cancelled up to 15 days before the event date, we will not charge a cancellation fee. In case of cancellation in the period from 15 to 7 days before the event date, we will charge a processing fee of 50% of the participation fee. In case of later cancellations, the entire participation fee will be charged. BODO MÖLLER CHEMIE GmbH reserves the right to make any changes or to cancel the event for urgent reasons.
Speaker
Dr. Christoph Schnöll, Bodo Möller Chemie
Vice President of Technology
Philipp Capol, Bodo Möller Chemie
Site Director Bodo Möller Chemie Schweiz
Sven Esders, Bodo Möller Chemie
Member of the executive Board BM Chemie Israel Ltd.
TBA
Location
NH Hotel ・ Heidelberg
Bergheimer Str. 91 ・ 69115 Heidelberg
Tel: +49 6221 13270
E-mail: nhheidelberg@nh-hotels.com
A limited number of rooms are available at the conference hotel at special rates. If required, please make your room reservation directly with the hotel under the keyword ≪Klebstoff-Seminar Bodo Möller Chemie≫.
Upcoming Events
Bodo Möller Chemie organizes events on various chemical solutions under the name TechDialog.
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