Select Page
Generic filters
Exact matches only

Hotmelts

We offer a very extensive adhesive portfolio for packaging applications and the packaging industry. Dispersions as well as hotmelts are used on different chemical bases.

Home » Solutions » Adhesives » Hotmelts & packaging adhesives » Hotmelts

Hotmelts

For a wide variety of packaging applications, such as anti-slip coating of paper bags, end-of-line carton closure or drinking straw gluing. Partially approved for indirect food contact according to FDA or BFR.
Packaging & Paper converting

Kaurit® 1-component Urea Formaldehyde Resin

This glue powder is used for hot-process surface gluing, and tapeless veneer splicing without the addition of further extender after mixing with water.

Kaurit® Impregnating resins

Characterized by their excellent adhesiveness and high scratch resistance. Used for the coating of laminate floors, or for furniture production.

Planatolin Solvent

Cleaning agent to be used for cleaning of application units for PUR-hotmelt adhesives.

Unimelt Hotmelt

EVAc hot melt adhesive, is a one- component hot melt for edge-banding of various substrates. The adhesive is characterized by a short open time and good adhesion on various substrates.

Unimelt PUR Polyurethane Hotmelt

A moisture-curable one- component hot melt for lamination and edge-banding of various The adhesive is characterized by good adhesion on various substrates.

Unitol dispersion adhesives

An aqueous poly vinyl acetate dispersion with crosslinking properties and a lowered minimum film forming temperature. The special features are an excellent water resistance, a high bond strength and heat resistance and a good setting time.

Bodo Möller Chemie

Adhesive systems for industrial applications

Adhesives Competence Center EN

Adhesives Laboratory

Partners

Araldite® – Bonding and void filling solutions for aerospace industry
All Downloads

Solutions

Events

ASB Expo 2023 Adhesives Sealants & Bonding

05.09.2023 - 07.09.2023, Dubai
More Events

News

Strategic advance into the future: Bodo Möller Chemie commits to global growth Bodo Möller Chemie chartered its course into the future

17.05.2023

After great success last year, targets are set until 2030

Bonding technologies in industrial production: Technical seminar in Heidelberg Bodo Möller Chemie presents modern bonding solutions in the May 11, 2023 TechDialog

14.03.2023

Bodo Möller Chemie presents modern bonding solutions in the May 11, 2023 TechDialog
Specific challenges are discussed in small-group workshops

Bodo Möller Chemie and Von Roll cooperate in the area of electronics resin systems Portfolio expansion in the area of casting resins for the electrical and electronics industry

13.03.2023

Portfolio expansion in the area of casting resins for the electrical and electronics industry

More News