3M™ Double Coated Tape GPT-020F have high instant adhesion, high temperature and humidity resistance and excellent shear performance. The tapes bond to many high surface energy substrates and some low surface energy substrates, including stainless steel, HDPE, ABS, acrylic, PP, polycarbonate, aluminium or glass. The tape is suitable for various markets and applications including POP/POS displays, light boxes, sports equipment, indoor and outdoor signs, furniture trim attachment, mounting of electronics or plastic parts.
3M™VHB™ Tape Series are high performance double sided tapes made from 100% closed-cell acrylic foam. The tapes exhibit with a high initial tack, have excellent bonding properties with high tensile and shear strength, have high temperature-, weathering-, UV- and solvent resistance and conformability and bond materials with rough or smooth surfaces, too. 3M™ VHB™ tapes are suitable for many materials and are used today in a wide variety of markets such as rail and commercial vehicles, electronics, windows and doors, household appliances and in the construction, aerospace and furniture industries.
3M™ spray adhesive are suitable for OEM to on-site construction fabrication. 3M™ spray adhesives are suitable for bonding to metal, high-pressure laminate (HPL), plastic, insulation, foam, fabric, wood, MDF and a wide range of other substrates. 3M™ spray adhesive offer many advantages, including being very efficient on large surfaces, being quick to apply, convenient and easy to use, eliminating equipment maintenance and other costs. One of the most popular spray adhesives is 3M™ Super 77™ Multipurpose Spray Adhesive.
HI-FLOW phase change materials are an optimal replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow. More information
GAP FILLER is supplied as a one or two-part component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling electronic components on PC boards with an adjacent metal case or heat sink. Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process. More information
GAP PADs provide an effective thermal interface between heat sinks and electronic devices to offset uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interfacial resistance. GAP PADs reduce the stress on component leads, dampen vibration and are compatible with automatic dosing systems. More information
These materials are designed for those applications when maximum heat transfer is needed and electrical isolation is not required, making SIL PAD® the ideal thermal interface material to replace messy thermal-grease compounds. More information
The thermally conductive insulation pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, cleaner in processing than greases and extremely cost effective. More information
Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion. More information
