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Sensors

Aggressive environmental conditions and thermal requirements require high demands on the potting compound, which is used for the encapsulation of sensors of various assemblies. In some applications plugs and switches are used.

Araldite® 2-component epoxy resin adhesives

Depending on the type, they can be used for structural bonding of metals, thermosets and reinforced plastics. Can have very high strength and temperature resistance (up to 210°C).

Arathane® 2-component polyurethane casting resins

Potting compounds with very good processing properties, for very flexible to hard moulding materials with good temperature stability up to thermal class F, thermally conductive, UL94.

DOWSIL™ and SYLGARD™ Silicone encapsulants

Encapsulants offer greater design flexibility. Their softness and lower stress make them ideal for devices with sensitive components. Thermally conductive pottants protect from moisture and dust while dissipating heat and absorbing component noise.

Euromelt® 2-component polyamide hotmelt casting compounds

1-component co-polyamides for a wide operating temperature range and low viscosity for very good flow behavior with only low potting pressure.

Bodo Möller Chemie

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Car Symposium 2023

03.05.2023 - 04.05.2023, Bochum

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Bodo Möller Chemie presents modern bonding solutions in the May 11, 2023 TechDialog
Specific challenges are discussed in small-group workshops