Select Page
Search
Generic filters
Exact matches only

Sensors

Aggressive environmental conditions and thermal requirements require high demands on the potting compound, which is used for the encapsulation of sensors of various assemblies. In some applications plugs and switches are used.

Araldite® 2-component epoxy resin adhesives

Depending on the type, they can be used for structural bonding of metals, thermosets and reinforced plastics. Can have very high strength and temperature resistance (up to 210°C).

Arathane® 2-component polyurethane casting resins

Potting compounds with very good processing properties, for very flexible to hard moulding materials with good temperature stability up to thermal class F, thermally conductive, UL94.

DOWSIL™ and SYLGARD™ Silicone encapsulants

Encapsulants offer greater design flexibility. Their softness and lower stress make them ideal for devices with sensitive components. Thermally conductive pottants protect from moisture and dust while dissipating heat and absorbing component noise.

Euromelt® 2-component polyamide hotmelt casting compounds

1-component co-polyamides for a wide operating temperature range and low viscosity for very good flow behavior with only low potting pressure.

Events

Bonding Seminar 2020

22.10.2020, Heidelberg

JEC World 2021

09.03.2021 - 11.03.2021, Paris

News

1,000 m² of dangerous goods storage for more growth in Poland, the Czech Republic and Slovakia

Bodo Möller Chemie deepens its collaboration with BASF in the segment of Dispersions for Coatings and Construction Polymers in the African core markets