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Hotmelt casting compounds

Thermoplastic plastics for low-pressure casting in electronic and electrical applications, e.g. casting of circuit boards and plugs, sealing of cables. Hotmelt materials are not reactive. The application takes place in solid forms, comparable to plastic injection moulding. The materials used are high-quality thermoplastic polyamide hot-melt adhesives (PA) with elastomeric properties.

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Euromelt® 2-component polyamide hotmelt casting compounds

1-component co-polyamides for a wide operating temperature range and low viscosity for very good flow behavior with only low potting pressure.
Aerospace & defense | Automotive | Bus & truck | E-mobility | Electronics | Marine | Rail | Wind energy

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Bodo Möller Chemie and CABB form partnership Dianhydrides for high-performance epoxy and polyimide formulas

08.11.2023

Bodo Möller Chemie is expanding its portfolio in the CASE sector (coatings, adhesives, sealants and elastomers) through its collaboration with CABB, the dianhydride specialist.

Bodo Möller Chemie and Henkel Adhesive Technologies expand cooperative partnership News for the Swiss electrical and electronics industry

06.10.2023

With the aim of consolidating their positions on the market, Bodo Möller Chemie Group and Henkel Adhesive Technologies added Switzerland to their collaboration very recently.

Bodo Möller Chemie offers seminar for electrical and electronics industry TechDialog seminar: Comprehensive Product Technologies Know-How

29.08.2023

TechDialog seminar: Comprehensive Product Technologies Know-How
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