Reactive dyes of the latest generation. Extremely environmentally friendly as it is very energy and water saving.
Dyeing - Performance chemicals - Textile industry
AXAREL® Precision cleaner for electronics production
Solvent-based cleaner for adhesive tape and flux residues, residues of SMD adhesives and solder pastes. Can be used manually or in immersion and ultrasonic cleaning processes.
Electronics - Formulated systems - Maintenance, repair & cleaning of aerospace components
Baerostab® Epoxidized vegetable oils
Irgafos additives are secondary antioxidants that act as peroxy radical scavengers during plastics processing.
Performance chemicals - Plastic processing industry
Basonat® Isocyanate hardeners
Isocyanate hardener for 2-component polyurethane applications.
Automotive & transportation - CASE & Construction chemicals - Industrial coatings - Performance chemicals - Wood coatings
BERGQUIST® BOND-PLY Adhesives tapes
Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion. More information
Assemblies & printed circuit boards - Electronics - Formulated systems - LED technology
BERGQUIST® GAP FILLER
GAP FILLER is supplied as a one or two-part component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling electronic components on PC boards with an adjacent metal case or heat sink. Because Gap Filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process. More information
Assemblies & printed circuit boards - Electronics - Formulated systems - LED technology
BERGQUIST® GAP PAD®s
GAP PADs provide an effective thermal interface between heat sinks and electronic devices to offset uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interfacial resistance. GAP PADs reduce the stress on component leads, dampen vibration and are compatible with automatic dosing systems. More information
Assemblies & printed circuit boards - Electronics - Formulated systems - LED technology
BERGQUIST® HI-FLOW Pads
HI-FLOW phase change materials are an optimal replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow. More information
Assemblies & printed circuit boards - Electronics - Formulated systems - LED technology
BERGQUIST® SIL PAD® Electrically insulating thin pads
The thermally conductive insulation pads are a clean and effective alternative to mica, ceramic or grease for a wide range of electronic applications. They offer excellent thermal conductivity, are more durable than mica, cleaner in processing than greases and extremely cost effective. More information
Assemblies & printed circuit boards - Electronics - Formulated systems - LED technology
BERGQUIST® SIL PAD® Non-electrically insulating thin pads
These materials are designed for those applications when maximum heat transfer is needed and electrical isolation is not required, making SIL PAD® the ideal thermal interface material to replace messy thermal-grease compounds. More information
Assemblies & printed circuit boards - Electronics - Formulated systems - LED technology