Light-curing adhesives are the product group with the most varied properties. When the adhesives are exposed to appropriate UV and/or visible light, stable, durable thermoset polymers are produced. The product properties range from hard and rigid to soft and flexible. Fluorescent-modified products allow in-line detection of adhesives.
Formulated systems - Medical devices
LOCTITE® Adhesive films
Adhesive films are reactive materials that are usually supplied frozen as roll goods. They are mainly used for bonding metal and composite components and for honeycomb sandwich structures.
Aerospace & defense - Bonding of cabin components - Local reinforcement of honeycomb cores & component edges
LOCTITE® Conformal Coatings
LOCTITE® Conformal coatings protect printed circuit boards and substrates from thermal shock, humidity, corrosive liquids and other adverse environmental conditions, ensuring long product life cycles for exposed applications in the marine, automotive, medical and consumer electronics markets. More information or buy online now.
Assemblies & printed circuit boards - Electronics - Formulated systems
LOCTITE® Core / edge fillers
Core / edge fillers are used in honeycomb sandwich components for local reinforcement and edge closure. They are offered in different densities and compressive strengths.
Aerospace & defense - Formulated systems - Local reinforcement of honeycomb cores & component edges
LOCTITE® Cyanoacrylate adhesives
Loctite® instant adhesives are high performance cyanoacrylates designed for the most demanding applications. They offer excellent adhesion to many different materials and are perfect for bonding plastics such as ABS, PVC, polycarbonates, acrylics and thermosets as well as elastomers such as latex, TPU, TPE and PUR. By incorporating available LOCTITE® primers, bonding traditionally difficult materials such as PP, PE and other low surface energy rubbers and plastics is easily done.
Formulated systems - Medical devices
LOCTITE® ECCOBOND Underfill materials
Underfillers are designed to provide a uniform and void-free encapsulant underfill, maximizing the
device’s temperature cycling capability, distributing stress in packages. Weitere Informationen.
Assemblies & printed circuit boards - Electronics - Formulated systems
LOCTITE® ECCOBOND-COB Encapsulants
Encapsulants provide unmatched performance for a wide range of products, including transistors, system-in-package (SIP) devices, ASICs and chip-on-board applications. More Information
Assemblies & printed circuit boards - Electronics - Formulated systems
LOCTITE® Epoxy resin adhesives for medical devices
LOCTITE® epoxy adhesives offer high peel and shear strength on a wide range of metals and plastics. When cured, these crosslinked thermoset polymers exhibit excellent heat and chemical resistance, high cohesive strength and minimal shrinkage. The two-component LOCTITE® epoxy adhesives are packaged in double cartridges that can be processed like single-component adhesives using static mixers.
Formulated systems - Medical devices
LOCTITE® Film adhesives
Epoxy film adhesives are perfectly suited for large bonding areas that also require uniformed bondlines and custom sizes and shapes. Assembly films are proven solutions for the most demanding applications requiring the highest reliability. More Information
Assemblies & printed circuit boards - Electronics - Formulated systems
LOCTITE® Hybrid adhesives
LOCTITE® hybrid adhesives combine the advantages of instant adhesives with the benefits of structural adhesives such as epoxy resins. As a result, a very fast setting time with high final strengths and resistance to temperature and media can be achieved. A further advantage of the hybrid adhesives is the processing, as these products have been optimized and require minimal marking.
