Bonding technologies in industrial production: Technical seminar in Heidelberg Bodo Möller Chemie presents modern bonding solutions in the May 11, 2023 TechDialog
With a new structure, the Bodo Möller Chemie Group inaugurates this year’s continuation of the successful seminar series TechDialog. On May 11, 2023, the company in Heidelberg will not only present a general introduction to the current industrial bonding options, but will also make it possible to analyze the specific challenges that can be discussed on-site with the attending experts in small, practical workshops. “Our customers often pose very challenging demands on specific industrial bonding solutions that are frequently part of a confidential production process. With the new seminar structure – separated into a talk and small-group workshops – we facilitate the interactive exchange and offer in case of need precise solutions for individual problems,” explains Dr. Christoph Schnöll, Vice President of Technology at the Bodo Möller Chemie Group.
Leading bonding expertise
In addition to an extensive product portfolio of leading industrial partners, the company also offers far-reaching application expertise. For its customers, it takes over laboratory tests and numerous services that are decisive before series production begins. Accordingly, the Bodo Möller Chemie Adhesive Competence Center (ACC) has comprehensive certifications for industrial bonding according to EN 6701-2 (Bonding for the Rail Industry), DIN 2304 (Quality Requirements for Adhesive Processes) and ISO 9001: 2015 (Quality Management). The ACC also offers valuable services to the automotive and aviation sectors. As close partner of the manufacturers of special adhesives, the Bodo Möller Chemie Group is technically up-to-date so it can give interested parties a profound insight into the current possibilities that adhesives have in industrial applications.
Seminar for users of all levels
The interactive technical seminar dealing with the subject of bonding technologies will take place at the NH Hotel in Heidelberg on May 11, 2023. It is aimed at users and professionals in industrial production, both newcomers and specialists. They are above all the bonding technology staff in the categories of European Adhesive Bonder (EAB), European Adhesive Specialists (EAS) and European Adhesive Engineer (EAE). The program covers the foundations of bonding technology, the optimal selection and application of adhesives in practice, high-performance adhesive tapes and their application, furthermore scale-up with machine technology in the application of adhesives, a deeper know-how in bonding technology and personal technical consulting regarding individual bonding applications. A subsequent discussion completes the seminar and offers the opportunity of an interdisciplinary exchange. For the implementing bonding technology staff, the seminar is recognized as qualified continuing education measure. Early registrations made until April 7, 2023 are 325 euros plus VAT per person, those made until the April 28 registration deadline are charged at the normal price of 375 euros plus VAT per person. Participation can be booked via this link.