Seminar „Encapsulation of electrical and electronic devices” starts for the second round
In October 2011, the new seminar series on electronics encapsulating met with strong interest. The event was fully booked! For this reason on 15th March 2012 in Regensburg, the second seminar will take place.
Based on years of success of the bonding seminars organized by Bodo Möller Chemie and Huntsman Advanced Materials, on 5th October 2011 for the first time was held a seminar entitled „Encapsulation of electrical and electronic devices”. The demand was so great that it was decided to organize as soon as possible another electronics seminar: On 15th March 2012 Bodo Möller Chemie and Huntsman will organize the event „Encapsulation of electrical and electronic devices” in Regensburg.
The seminar is aimed at users who want to know the benefits of using compounds for encapsulation and the related opportunities and is interesting for production and development departments. Today, high-quality encapsulating compounds are used in a variety of industrial sectors, such as sensors, controllers, inductive components (eg. transformers, motors, etc.). Users also benefit in many other markets of the innovations in the sector of encapsulating, like cold flexible systems and cast-and-go systems.
In this seminar we want to convey in terms of technical presentations, product presentations, workshops and case studies a wide range of information: from the basic knowledge about processing, system selection and technical characteristics of encapsulating compounds to practical and technical expertise.
Ort: Ziegetsdorfer Straße 111 , Regensburg