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Chip on board (COB) Encapsulants

15.03.2023

Encapsulants provide unmatched performance for a wide range of products, including transistors, system-in-package (SIP) devices, ASICs and chip-on-board applications. Henkel’s LOCTITE® and LOCTITE ECCOBOND-COB encapsulation compounds are primarily used to provide protection from external influences and to increase the mechanical strength of wired components.

For more information, follow the link to our electronic adhesives page.

Corporate Marketing

Senefeldertraße 176
63069 Offenbach am Main
Germany

+49 69 838326-137
+49 69 838326-166
marketing@bm-chemie.de

Events

Seminar: Design and application of chemical products in electronics production

14.05.2024, Rapperswil-Jona

TechDialog: Adhesive technologies in industrial manufacturing

16.05.2024, Heidelberg

The Battery Show Europe 2024

18.06.2024 - 20.06.2024, Stuttgart
More Events

News

Bodo Möller Chemie obtains majority share in distribution company Losi Group Expansion into aerospace market signals key milestone in growth strategy

08.02.2024

Bodo Möller Chemie obtains majority share in distribution company Losi Group and expands into aerospace market

JEC World: Bodo Möller Chemie presents technological innovations for composites: Dianhydride and Debonding on Demand Expert lecture on dianhydrides during trade fair

25.01.2024

JEC World: Bodo Möller Chemie presents technological innovations and an expert lecture during the trade fair.

Bodo Möller chemie expands its collaboration with SONGWON Exclusive distributor for coating products in Germany

16.01.2024

Bodo Möller Chemie expands its collaboration with SONGWON and is now exclusive distributor for coating products in Germany.
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